Giro Helios Spherical Mips helmet

Advanced performance for speed and adventure

The heart of the Helios’ extraordinary design and performance is Spherical Technology, which utilizes a ball-and-socket design powered by MIPS®, the market-leading brain protection system that can help to reduce rotational forces. Spherical Technology allows the helmet’s outer liner to rotate around the inner liner during a crash, and also allows Progressive Layering of the inner and outer liners to provide more comprehensive protection and performance. In addition to advanced head protection, the Helios’ 15 Wind Tunnel vents provide exceptional cooling power that’s enhanced by the patented Roc Loc 5 Air fit system and plush, antimicrobial Ionic+ padding for exceptional sweat absorption. It’s the ideal match for your road and gravel adventures.


Features

  • Spherical Technology™.
  • MIPS® brain protection system Progressive Layering Nanobead EPS.
  • Ionic+™ anti-microbial padding.
  • Reflective decals.
  • Independent, In-Mold liners with spherical ball-and-socket design.
  • Full lower Hardbody coverage.
  • Roc Loc® 5 Air fit system.
  • 15 Wind Tunnel™ vents and deep internal channeling.
  • Complies with the us cpsc safety standard for bicycle helmet for persons age 5 and older E.U.: CE EN1078


Technology

MIPS Brain Protection

MIPS is a low friction layer inside the helmet which allows the head to rotate relatively to the helmet in an angled impact. This substantially reduces rotational violence and the potential for damage to the brain. Collaborating with some of the world's leading neurosurgeons and experts, MIPS® has established that when you fall, your head most often hits the ground at an angle, creating a rotational shock to the brain. This rotational shock can cause strain in your brain. A helmet with MIPS® absorbs much of that rotational energy, offering you better protection. And if, against all the odds, you do fall vertically onto your head, a helmet with MIPS® will protect you just as well as an ordinary helmet.